KCTN 2010 Thin Film Chip, SMT

Characteristics

Condition

Compliance

Tolerance

For 4.7 Ω - 1M Ω
For 4.7 Ω - 3M Ω
For 1 Ω - 3M Ω

±0.05%
±0.1%
±0.25% - ±1%

Temperature Coefficient

For 4.7 Ω - 1M Ω
For 4.7 Ω - 3M Ω
For 1 Ω - 3M Ω

±25/°C & ±50/°C
±25/°C & ±50/°C
±25/°C & ±50/°C

Insulation Resistance

100V DC for 1minute
(According to MIL-STD-202F METHOD302)

≥1000MΩ

Change in Resistance
- Short time overload

- Endurance


- Damp Heat with load


- Bending Strength
- Low Temperature Operation

- Resistance to soldering heat

- Thermal Shock

RCWV*2.5 or Max. overload voltage for 5sec
(2sec for high power series).
@70±2°C Max. working voltage for 1000hrs with 1.5hrs ON and 0.5hrs OFF.
(According to MIL-STD-202F METHOD108A)
@40±2°C,90~95% RH. Max. working voltage for 1000hrs with 1.5hrs ON and 0.5hrs OFF.
(According to MIL-STD-202F METHOD103B)
Bending amplitude 3mm for 10 seconds
-65°C 1hr, followed by 45minutes RCWV

260±5°C for 10 seconds (According to MIL-STD-202F METHOD210E)
-55°C to 150°C, 100 cycles
(According to MIL-STD-202F METHOD107G)

± 0.05% for Tol≤0.05%, ±0.2% for Tol>0.05%
± 0.2% for high power rating.
± 0.05% for Tol≤0.05%, ±0.2% for Tol>0.05%

± 0.5% for R>7kΩ & high power rating.

± 0.05% for Tol≤0.05%, ±0.3% for Tol>0.05%
± 0.5% for high power rating.
± 0.05% for Tol≤0.05%, ±0.2% for Tol>0.05%
± 0.05% for Tol≤0.05%, ±0.2% for Tol>0.05%
± 0.5% for high power rating.
± 0.05% for Tol≤0.05%, ±0.2% for Tol>0.05%

± 0.05% for Tol≤0.05%, ±0.25% for Tol>0.05%

Operating Temperature

-

-55 to +155°C

Solderability (where applicable)

245±5°C for 3 seconds (According to MIL-STD-202F METHOD103B)

>95%

Voltage Proof

Max overload voltage for 1minute (According to MIL-STD-202F METHOD301)

No breakdown